Motherboard Disassemble Platform Heating Groove For iPhone X/XS/XS Max – T12A – X3

Motherboard Disassemble Platform Heating Groove For iPhone X/XS/XS Max – T12A – X3

Note

This item is just including the iPhone X/XS/XS Max – T12A – X3 motherboard heating groove, not including the heating station’s main unit.

Specifications

● Model: T12A – X3

● Motherboard heating groove size: 126*72*18mm (L*W*H)

● Temperature: 100-280℃

Features

● The motherboard disassembles platform heating groove including the heating area for iPhone X/XS/XS Max, CPU glue removal area.

● The motherboard disassembles platform heating groove for iPhone X/XS/XS Max is only heating the middle column, without heating the CPU.

● Silicone insulation, high-temperature resistance, lowering the temperature of the bottom contact surface.

● High-purify copper is used as the contact surface to ensure uniform heat transfer and heat.

Compatibility

For iPhone X/XS/XS Max